Products

HEAT PIPE COOLING SYSTEMS

Although heat pipes have been known in their basical working principles since 19th century, it is only from the sixties that they are extensively used in several industrial fields.
B.T.M. is today able to propose a wide range of heat pipe coolers, especially intended for high power electronics components.
Thanks to their relatively simple structure and improved thermal characteristics, heat pipe coolers show substantial gain in weight and size reduction. In addition, they are totally maintenance-free with a proven operating reliability in eccess 30 years.
Heat pipe coolers can be designed and manufactured with an electrical insulation up to 12 kV, while the two parts of the thermal circuit, respectively the condensing and evaporating sections, can be phisycally separated to avoid hazardous contacts and dust accumulation.
The versatility of these systems allows a great freedom in designing customized thermal solutions.

A stack of 7,5 kV insulated heat pipe coolers (with AI²O³ insulators), designed for natural air cooling of a pair of thyristors for on-board equipments in a subway train.
Light construction with aluminum evaporator and fins.

A customized heat pipe unit, especially developed for the cooling, in natural air, of a pair of 130x140 mm IGBT (Eupec and Mitsubishi standard cases), for a total power of 1kW, to be used on on-board equipments in a subway train.
Provided with AI²O³ insulators (7,5 kV insulation).

A stack of non insulated heat pipe sinks, designed to cool a pair of thyristors with forced ventilation, mounted with a special clamping equipment manufactured by B.T.M.
The equipment is intended for use in conjunction with an AC mill drive

HEAT EXCHANGERS A new solution for the cooling of sealed containers. Based upon the heat pipe technology, the Borsari Thermal Management Heat Exchangers have wider radiating surfaces, thus saving weight and dimensions, when compared with the conventional cooling systems.
	The picture shows a heat exchanger designed for the natural air cooling of a sealed container, designed for on-board equipment of a tramway. Dissipating surface: 10 m² approx. Total weight: 25 kg.

ASSEMBLED HEAT SINKS

A new range of heat sinks, whose configuration can be easily adapted to the customer requirements, overcomes the limitations imposed by the extrusion technology.
The connection between the base and the fins is obtained by means of an epoxy bonding.
The improvement of the thermal efficiency of the fins, thanks to an ideal pitch, results in a lower thermal resistance (up to 20%) and weight saving (up to 7%), when compared with a same dimension traditional extruded heat sink.

BOX AND BAR CLAMPS

A complete range of disc cell clamping devices, both for single and double side applications of the most used press-pack semiconductors.

INSULATED WATER COOLERS Manufactured with the most advanced technologies, water cooled and insulated heat sinks provide electrical separation of the electronic component from the water circuit by means of high thermal conductive ceramic components. They are further designed with oversized superficial discharged paths and feature very low total thermal resistance.
A reliable, efficient, economic and ecological alternative to freon cooling and treated water coolants systems.